Senior Manager, PCB Design

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About the Company - pSemi Corporation is a Murata company driving semiconductor integration. pSemi builds on Peregrine Semiconductors 30-year legacy of technology advancements and strong IP portfolio but with a new missionto enhance Muratas world-class capabilities with high-performance semiconductors. With a strong foundation in RF integration, pSemis product portfolio now spans power management, connected sensors, optical transceivers, antenna tuning and RF frontends. These intelligent and efficient semiconductors enable advanced modules for smartphones, base stations, personal computers, electric vehicles, data centers, IoT devices and healthcare. From headquarters in San Diego and offices around the world, pSemis team explores new ways to make electronics for the connected world smaller, thinner, faster and better.

About the Role - The Senior Manager will lead a dynamic team of PCB designers responsible for the development of complex, high-performance PCBs for cutting-edge semiconductor products. This role requires both technical expertise in PCB fabrication and design. This role also requires strong leadership skills to mentor and guide the team towards success. This person will work hand in hand with both Packaging, EM, and RFIC design teams in managing PCB design processes, fostering cross-functional collaboration, and delivering high-quality products in fast-paced environment. This position will report to the Director of NPI packaging and Printed Circuit Design.

Responsibilities:

• Lead, mentor, and grow a team of PCB designers, providing technical guidance and career development opportunities.
• Foster a collaborative and innovative environment to ensure high levels of team performance.
• Develop and maintain best practices for PCB design and review processes to optimize quality and efficiency.
• Ensure designs comply with relevant industry standards (IPC, JEDEC, etc.), and are fully optimized for performance, reliability, and manufacturability.
• Collaborate with suppliers, EM and IC design teams to define high performance PCB stackups and strive for standardization to maintain the best value to pSemi.
• Manage multiple PCB design projects, ensuring that timelines, budgets, and quality targets are met.
• Ongoing oversite of work in process, monitoring of backlog, and communication of status to balance business priorities within the PCB design environment.
• Drive continuous improvement in PCB design processes and tools to increase productivity and reduce design cycle time.
• Manage PCB design tools, oversite of PCB tool licensing, and train team members to use tools.
• Track, monitor, forecast, and report on PCB spend.

Qualifications:

• Minimum of 7-10 years of experience in PCB design, with at least 3-5 years in a managerial or leadership role.
• Strong leadership and team management skills, with a demonstrated ability to motivate and develop engineers.
• Excellent problem-solving skills and the ability to work effectively under pressure.
• Strong communication skills, both written and verbal, to interface with internal teams, suppliers, and customers.
• Experience with scripting and automation preferably with Cadence Skill code.
• Proficiency with PCB design tools such as Cadence Allegro(required), Zuken Design Force (preferred), or similar.
• Hands on experience with printed circuit board layout from library development, schematic capture, parts placement, layout, and generation of all derived outputs necessary for fabrication and assembly.
• Familiarity with PCB manufacturing processes, including stack-up design, material selection, and an understanding of the sequence of manufacturing steps based on design construction.
• Familiarity with EM and thermal simulation tools and the corresponding data exchange between tools.
• Experience with supporting RMA investigations.

Preferred Skills:

• Strong working knowledge and experience working with Asian subcontract bump and assembly suppliers.
• Familiarity with EM concepts and techniques for optimizing impedances, ground inductances, and isolation.
• Ability to use statistical analysis tools and concepts, including Design of Experiment methodology applied to process development.
• Experience with Mechanical design tools such as AutoCad or solidworks.

Pay range and compensation package - USD 167,999.01 - 230,998.64 per year

Equal Opportunity Statement - pSemi Corporation supports a diverse workforce and is committed to a policy of equal employment opportunity for applicants and employees. pSemi does not discriminate on the basis of age, race, color, religion (including religious dress and grooming practices), sex/gender (including pregnancy, childbirth, or related medical conditions or breastfeeding), gender identity, gender expression, genetic information, national origin (including language use restrictions and possession of a drivers license issued under Vehicle Code section 12801.9), ancestry, physical or mental disability, legally-protected medical condition, military or veteran status (including protected veterans under applicable affirmative action laws), marital status, sexual orientation, or any other basis protected by local, state or federal laws applicable to the Company. pSemi also prohibits discrimination based on the perception that an employee or applicant has any of those characteristics, or is associated with a person who has or is perceived as having any of those characteristics.

Seniority level

• Seniority level

  Mid-Senior level

Employment type

• Employment type

  Full-time

Job function

• Job function

  Design

• Industries

  Semiconductor Manufacturing and Appliances, Electrical, and Electronics Manufacturing

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Medical insurance

Vision insurance

401(k)

Pension plan

Tuition assistance

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