Headway Technologies is hiring: Thin Film Process Development Engineer (Writer)

Overview

Thin Film Process Development Engineer (Writer). Location: Milpitas, CA. Salary range: $120,819.00 - $177,675.00 per year + bonus target + benefits. This position reports to the Director, Thin Film Process Development Engineering.

Under the direction of the Director of Thin Film Process Development Engineering, the Thin Film Process Development Engineer is responsible for developing, monitoring, sustaining, and supporting advanced writer film, PMR, TAMR or other sensor processes for new and prototype products; designing and conducting advanced wafer experiments, analyzing the data, and reporting the results; developing and implementing new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions.

Responsibilities

• Develops, sustains, and supports advanced thin film processes for new and prototype products; develops and implements novel approaches to improve and optimize PMR, TAMR and advanced writer processes
• Develops and implements practices or methodologies which reduce cost and improve operational efficiency
• Conducts root cause analysis and implements corrective action if required
• Develops and implements processes or procedures for transitioning new products into the production line
• Resolves process issues related to material selection; recommends corrective action
• Reviews, updates, and maintains documentation and process instructions
• Instructs operators and technicians on processes and procedures, including modifications to existing procedures
• Partners with equipment and maintenance personnel to minimize tool downtime and integrate new tools into the production line
• Designs and conducts advanced experiments, analyzes data, and develops recommendations for improving performance or reducing cost based on test results
• Collaborates with process and product engineering and other groups to develop and implement new processes which reduce scrap and improve yield
• Responds to inquiries from team members, managers, or departments
• Adheres to all safety policies and procedures
• Performs other duties of a similar nature or level as required

Qualifications

• Master’s degree in Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience; PhD preferred
• Three years of hands-on experience in PVD/IBD/CVD/ALD/PECVD technology
• Strong industry experience in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film process development engineering role
• Strong knowledge and experience using JMP, SPC, or similar software
• Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities

• Strong knowledge and experience of PVD, IBD, CVD, ALD, PECVD processes in PMR, TAMR, and other writer areas
• Strong knowledge of thin film manufacturing processes, practices, and techniques
• Strong knowledge of wafer fabrication processing techniques and tools such as PVD, IBD, CVD, ALD, and PECVD
• Ability to use Microsoft Office to create spreadsheets, documents, and presentations
• Ability to design experiments, analyze results, and recommend corrective action to reduce scrap and improve yield
• Strong critical thinking to resolve issues, perform root cause analysis, and propose process improvements
• Effective communication skills, both verbal and written, with all levels of staff and management
• Ability to work collaboratively across levels of employees and management
• Commitment to safety policies and procedures
• Strong organizational and time management skills
• Problem-solving and troubleshooting skills
• Flexibility and ability to prioritize

Working Conditions

Works primarily in an office environment; schedule may vary to meet business needs. May travel between sites. May work in a class 100 ESD-sensitive wafer fab environment and wear appropriate safety attire. May be exposed to hazardous chemicals, fumes, or vapors and loud noises in the wafer manufacturing facility. Occasional lifting of 20 pounds or more.

DDK/Headway Technologies, Inc. is an equal employment opportunity employer. Applications from all qualified individuals are welcome without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation should contact the Headway Human Resources Department.

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