Molex
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Interconnect Systems International, LLC ("ISI"), a subsidiary company and part of the Molex family, is looking for a Sr. Printed Circuit Board Designer for the Advanced Packaging & Microelectronics segment. Potential candidates should be experienced in printed circuit board and substrate layout and design, and be able to manage a small team with multiple projects. Candidates should be able to engage and collaborate with team members, customers, suppliers, and internal stakeholders to help effectuate new designs, prototypes, and production assemblies. This position offers the opportunity to work on new products and technologies to help boost revenue growth and new customer acquisitions. If you are interested in joining a highly respected, dynamic global technology company, we’d like to hear from you.
Location : This is an onsite role based at our facility in Camarillo, CA.
To comply with U.S. export control laws and regulations, this position requires applicants to either provide proof of U.S. citizenship or lawful permanent resident status or be eligible to receive an export authorization (a license) under the International Traffic in Arms Regulations and/or the Export Administration Regulations.
Our Team For over three decades, ISI has designed and delivered optimized microelectronics solutions that meet customers’ needs for more capable, denser, and ruggedized products. ISI’s system‑level design capabilities and vertically integrated manufacturing strategy enable ISI to quickly design, prototype, and manufacture mission‑critical solutions, which meet our customers’ technical and commercial requirements. ISI products and solutions are utilized across a variety of industries such as military‑aerospace, medical, transportation, and industrial.
What You Will Do
Design high‑speed printed circuit boards (PCBs) with blind/buried vias, controlled impedance, length matching, material selection, and complex stack‑ups
Utilize PCB layout, Altum design, Draftsman, stack‑up manager, design rule setup and other hardware design software (e.g., AutoCAD, SolidWorks, etc.)
Collaborate with a small team of designers to effectively progress projects from design to manufacturing
Engage with customers in onboarding technical requirements for new microelectronic and embedded hardware assemblies
Collaborate with internal engineering resources and external vendors for PCBs to develop designs that meet customer requirements and expectations
Collaborate with internal manufacturing teams to assist in the development of prototypes and production‑level assemblies
Develop and maintain a deep technical and commercial understanding of the PCB and substrate product segment and its relevant technological trends
Perform other related duties as assigned by management
Who You Are (Basic Qualifications)
5+ years of experience designing printed circuit boards or substrates
Experience with microelectronics packaging & embedded hardware design & new product development
Familiarity with PCB and substrate suppliers, fabrication methods, materials, surface finishes, reliability, and cost factors
Experienced in deep technical engagements with customers on new products or technologies related to PCBs and substrates
Project management experience
What Will Put You Ahead
Familiarity with complex PCB and substrate design for challenging and cutting‑edge applications requiring signal and power integrity analysis
Successful supervisory experience
Industry knowledge in aerospace & defense market segments
Excellent communication skills, developed in technical environments
Design software experience (Altium, AutoCAD, etc.)
Based on market rates, we anticipate paying $125,000 – $175,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.
Equal Opportunity Employer Equal Opportunity Employer, including disability and protected veteran status. Except where prohibited by state law, some offers of employment are conditioned upon successfully passing a drug test. This employer uses E‑Verify.
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Interconnect Systems International, LLC ("ISI"), a subsidiary company and part of the Molex family, is looking for a Sr. Printed Circuit Board Designer for the Advanced Packaging & Microelectronics segment. Potential candidates should be experienced in printed circuit board and substrate layout and design, and be able to manage a small team with multiple projects. Candidates should be able to engage and collaborate with team members, customers, suppliers, and internal stakeholders to help effectuate new designs, prototypes, and production assemblies. This position offers the opportunity to work on new products and technologies to help boost revenue growth and new customer acquisitions. If you are interested in joining a highly respected, dynamic global technology company, we’d like to hear from you.
Location : This is an onsite role based at our facility in Camarillo, CA.
To comply with U.S. export control laws and regulations, this position requires applicants to either provide proof of U.S. citizenship or lawful permanent resident status or be eligible to receive an export authorization (a license) under the International Traffic in Arms Regulations and/or the Export Administration Regulations.
Our Team For over three decades, ISI has designed and delivered optimized microelectronics solutions that meet customers’ needs for more capable, denser, and ruggedized products. ISI’s system‑level design capabilities and vertically integrated manufacturing strategy enable ISI to quickly design, prototype, and manufacture mission‑critical solutions, which meet our customers’ technical and commercial requirements. ISI products and solutions are utilized across a variety of industries such as military‑aerospace, medical, transportation, and industrial.
What You Will Do
Design high‑speed printed circuit boards (PCBs) with blind/buried vias, controlled impedance, length matching, material selection, and complex stack‑ups
Utilize PCB layout, Altum design, Draftsman, stack‑up manager, design rule setup and other hardware design software (e.g., AutoCAD, SolidWorks, etc.)
Collaborate with a small team of designers to effectively progress projects from design to manufacturing
Engage with customers in onboarding technical requirements for new microelectronic and embedded hardware assemblies
Collaborate with internal engineering resources and external vendors for PCBs to develop designs that meet customer requirements and expectations
Collaborate with internal manufacturing teams to assist in the development of prototypes and production‑level assemblies
Develop and maintain a deep technical and commercial understanding of the PCB and substrate product segment and its relevant technological trends
Perform other related duties as assigned by management
Who You Are (Basic Qualifications)
5+ years of experience designing printed circuit boards or substrates
Experience with microelectronics packaging & embedded hardware design & new product development
Familiarity with PCB and substrate suppliers, fabrication methods, materials, surface finishes, reliability, and cost factors
Experienced in deep technical engagements with customers on new products or technologies related to PCBs and substrates
Project management experience
What Will Put You Ahead
Familiarity with complex PCB and substrate design for challenging and cutting‑edge applications requiring signal and power integrity analysis
Successful supervisory experience
Industry knowledge in aerospace & defense market segments
Excellent communication skills, developed in technical environments
Design software experience (Altium, AutoCAD, etc.)
Based on market rates, we anticipate paying $125,000 – $175,000 per year. This role is eligible for variable pay, issued as a monetary bonus or in another form.
Equal Opportunity Employer Equal Opportunity Employer, including disability and protected veteran status. Except where prohibited by state law, some offers of employment are conditioned upon successfully passing a drug test. This employer uses E‑Verify.
#J-18808-Ljbffr