Headway Technologies
Sr. Thin Film Manufacturing Engineer
Headway Technologies, Milpitas, California, United States, 95035
SR. THIN FILM MANUFACTURING ENGINEER
FLSA STATUS: EXEMPT
REPORTS TO: DIRECTOR, THIN FILM MANUFACTURING ENGINEERING
SUMMARY Under the direction of the Director of Thin Film Manufacturing Engineering, the Senior Thin Film Manufacturing Engineer is responsible for monitoring, sustaining, and supporting day‑to‑day thin film manufacturing processes that utilize ion beam techniques. The role includes providing technical support to operators and engineers, verifying process robustness through experimental characterization, improving deposition and dry‑etching efficiency, developing cost‑reducing practices, conducting root cause analysis, and optimizing production yields via tool and process manufacturability improvements. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS
Monitors, sustains, and supports day‑to‑day thin film manufacturing processes, programs, and activities.
Ensures process reliability by providing technical support to operators, technicians, and other engineers.
Collaborates with the development team regarding new deposition or dry‑etching process integration and manufacturing process improvements.
Improves the efficiency of deposition and/or dry‑etching processes by analyzing data, conducting experiments, and researching alternative methods to reduce scrap.
Designs and conducts experiments to verify process robustness with characterization of process latitudes.
Develops and implements practices or methodologies that lower cost, reduce cycle time, and improve operational efficiency.
Conducts root cause analysis and implements corrective action when required.
Responds to inquiries from other team members, managers, or departments.
Partners with equipment and maintenance personnel to minimize tool downtime.
Uses Statistical Process Control (SPC) to analyze product quality data, develops charts or reports, and presents findings to groups or teams.
Adheres to all safety policies and procedures as required.
Performs other duties of a similar nature or level.
QUALIFICATIONS MINIMUM QUALIFICATIONS
Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience; PhD preferred.
Five years of hands‑on experience in magnetic thin film fabrication or the semiconductor industry in a manufacturing or process engineering role.
Strong experience with magnetic thin films or semiconductor fabrication processes.
Hands‑on experience in SPC and Design of Experiments (DOE).
Proficiency in using Microsoft Office Applications.
KNOWLEDGE, SKILLS, AND ABILITIES
Strong knowledge of magnetic thin film fabrication techniques using PVD, RIE, ALD, and ion milling.
Knowledge of semiconductor or magnetic thin film fabrication techniques, processes, and tools.
Knowledge and experience with TMR, CPP GMR, spin‑transfer oscillator film processes.
Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB.
Knowledge and experience using JMP or Excel and the ability to create macro formulas.
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations.
Ability to design experiments, analyze results, and recommend corrective action.
Ability to communicate effectively, both verbally and in writing, with all levels of contractors, employees, and management.
Ability to work productively and collaboratively with all levels of employees and management.
Ability to comply with all safety policies and procedures.
Ability to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements.
Demonstrated critical thinking and analytical skills.
Demonstrated organizational and time management skills.
Demonstrated problem‑solving and troubleshooting skills.
Flexibility and ability to prioritize.
The annual base salary for this full‑time position is between $127,967.00 and $188,187.00, plus a bonus target and benefits. Salary within the range may vary based on additional factors including job responsibilities, job‑related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS The Senior Thin Film Manufacturing Engineer works primarily in an office environment from Monday through Friday. The schedule may be altered from time to time to meet business or operational needs and may require building‑to‑building travel. The engineer works in a class 100 ESD‑sensitive wafer manufacturing facility and wears a cleanroom suit, including hood, gloves, safety glasses, booties, and mask. Exposure to hazardous conditions, chemicals, fumes, gases, and loud noise may occur. Physical demands include standing, walking, bending, twisting, fine grasping movements, operating a computer, and occasionally pushing, pulling, or lifting up to 30 pounds.
Other duties of a similar nature or level may be required.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
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REPORTS TO: DIRECTOR, THIN FILM MANUFACTURING ENGINEERING
SUMMARY Under the direction of the Director of Thin Film Manufacturing Engineering, the Senior Thin Film Manufacturing Engineer is responsible for monitoring, sustaining, and supporting day‑to‑day thin film manufacturing processes that utilize ion beam techniques. The role includes providing technical support to operators and engineers, verifying process robustness through experimental characterization, improving deposition and dry‑etching efficiency, developing cost‑reducing practices, conducting root cause analysis, and optimizing production yields via tool and process manufacturability improvements. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS
Monitors, sustains, and supports day‑to‑day thin film manufacturing processes, programs, and activities.
Ensures process reliability by providing technical support to operators, technicians, and other engineers.
Collaborates with the development team regarding new deposition or dry‑etching process integration and manufacturing process improvements.
Improves the efficiency of deposition and/or dry‑etching processes by analyzing data, conducting experiments, and researching alternative methods to reduce scrap.
Designs and conducts experiments to verify process robustness with characterization of process latitudes.
Develops and implements practices or methodologies that lower cost, reduce cycle time, and improve operational efficiency.
Conducts root cause analysis and implements corrective action when required.
Responds to inquiries from other team members, managers, or departments.
Partners with equipment and maintenance personnel to minimize tool downtime.
Uses Statistical Process Control (SPC) to analyze product quality data, develops charts or reports, and presents findings to groups or teams.
Adheres to all safety policies and procedures as required.
Performs other duties of a similar nature or level.
QUALIFICATIONS MINIMUM QUALIFICATIONS
Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience; PhD preferred.
Five years of hands‑on experience in magnetic thin film fabrication or the semiconductor industry in a manufacturing or process engineering role.
Strong experience with magnetic thin films or semiconductor fabrication processes.
Hands‑on experience in SPC and Design of Experiments (DOE).
Proficiency in using Microsoft Office Applications.
KNOWLEDGE, SKILLS, AND ABILITIES
Strong knowledge of magnetic thin film fabrication techniques using PVD, RIE, ALD, and ion milling.
Knowledge of semiconductor or magnetic thin film fabrication techniques, processes, and tools.
Knowledge and experience with TMR, CPP GMR, spin‑transfer oscillator film processes.
Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB.
Knowledge and experience using JMP or Excel and the ability to create macro formulas.
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations.
Ability to design experiments, analyze results, and recommend corrective action.
Ability to communicate effectively, both verbally and in writing, with all levels of contractors, employees, and management.
Ability to work productively and collaboratively with all levels of employees and management.
Ability to comply with all safety policies and procedures.
Ability to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements.
Demonstrated critical thinking and analytical skills.
Demonstrated organizational and time management skills.
Demonstrated problem‑solving and troubleshooting skills.
Flexibility and ability to prioritize.
The annual base salary for this full‑time position is between $127,967.00 and $188,187.00, plus a bonus target and benefits. Salary within the range may vary based on additional factors including job responsibilities, job‑related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.
WORKING CONDITIONS The Senior Thin Film Manufacturing Engineer works primarily in an office environment from Monday through Friday. The schedule may be altered from time to time to meet business or operational needs and may require building‑to‑building travel. The engineer works in a class 100 ESD‑sensitive wafer manufacturing facility and wears a cleanroom suit, including hood, gloves, safety glasses, booties, and mask. Exposure to hazardous conditions, chemicals, fumes, gases, and loud noise may occur. Physical demands include standing, walking, bending, twisting, fine grasping movements, operating a computer, and occasionally pushing, pulling, or lifting up to 30 pounds.
Other duties of a similar nature or level may be required.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
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