Optical Packaging Design Lead – Fiber-to-Chip Interfaces

A cutting-edge technology firm in Santa Clara is seeking a Packaging Design Engineer to lead the development of silicon photonics packaging solutions. This hands-on role involves designing optical interfaces, collaborating with various teams, and working with contract manufacturers to ensure high-quality production. The ideal candidate will have over 5 years of experience in packaging design and a deep understanding of reliability engineering principles. Competitive salary ranges from $170,000 to $240,000 based on experience. #J-18808-Ljbffr