CAES
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Delivering mission‑critical, electronic solutions that protect lives. Use your creativity and critical thinking to take our products from concept to customer.
At CAES, we engineer solutions for the world’s most critical missions. We serve customers in the defense and aerospace markets.
Seeking a career that offers challenging, diverse projects and opportunities? Looking for a position with a company that offers long‑term professional advancement? Searching for a place that values a diverse, team‑based environment? Consider CAES.
The most important thing we build is TRUST.
Overview
Take ownership of a high‑fidelity end‑to‑end model & simulation for various phased array and radar applications; develop and integrate signal‑processing functions and conduct sub‑system trade studies; act as system engineer to guide architecture design decisions and define requirements on proposals; apply appropriate standards, processes, procedures and tools throughout the system development life cycle to support the generation of such engineering applications and products such as Radio Frequency (RF) and digital applications.
Responsibilities
Design RF/Analog circuits using simulation tools, generate BOM, and identify necessary equipment and components to perform test.
Perform PCB layout and/or interface with a layout engineer for PCB tape‑out.
Troubleshoot the circuit in test bench and simulation.
Provide RF/Analog performance to System Engineering.
Evaluate possible failure paths.
Assist product transition from engineering to manufacturing, including writing Acceptance Test Procedure (ATP).
Qualifications
Minimum Qualifications
Entry‑level role; first years of work experience.
Bachelor’s degree in Electronics Engineering or equivalent Engineering/Technical Degree.
Required to obtain and maintain security clearance within 6 months of employment.
Preferred Qualifications
MS degree in Electrical Engineering or Physics.
Design experience in RF components such as combiners, filters, switches, mixers, circulators, VCOs, Power Amplifiers and antennas.
HFSS simulation experience, thermal consideration in PA design, PCB/chip‑on‑board design, test and layout experience.
MTBF calculation and circuit failure analysis experience.
MMIC design and experience interacting with Foundry GaN, GaAs, InP or LDMOS semiconductor.
Load‑Pull experience.
Active DOD Secret Clearance.
Salary Range: $76,800 – $110,400 annually.
The application period for the job is estimated to be 40 days from the job posting date; however, this may be shortened or extended depending on business needs and the availability of qualified candidates. Job Posting Date: December 5, 2025.
Benefits
Comprehensive PTO, Paid Holiday and Paid Family Leave Programs.
Student Loan Repayment Program & Tuition Reimbursement.
Tailored Management/Leadership Training.
Innovative Medical Programs, including Family Forming.
Equal Opportunities Employer
At CAES we welcome differences and celebrate new ideas. We believe the diversity of our people inspires our creativity and drives our innovation. Everyone is welcome here, regardless of race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status, or genetic information.
We are committed to working with and providing reasonable accommodations to individuals with disabilities. If you need a reasonable accommodation due to a disability for any part of the employment process, please email CAEScareers@caes.com.
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