Senior Chip Package Designer for 2.5D/3.5D ML HPCs

A leading technology company in Sunnyvale is seeking a Chip Package Designer to develop advanced package substrate designs for machine learning hardware. You will manage design processes, collaborate with cross-functional teams, and implement innovative solutions to optimize electrical performance and reliability. This role offers competitive salary and is integral to the development of Google's cutting-edge technology products. #J-18808-Ljbffr