Wafer Bonding Engineer — Advanced Packaging & 3D ICs

A leading semiconductor manufacturer is seeking a Wafer Bonding Engineer for its Florida Advanced Packaging site. The role involves developing bonding and debonding capabilities for advanced packaging processes. Candidates must have a BS in engineering, 2-4 years of engineering experience, and knowledge of MEMS/CMOS packaging. The position offers a competitive salary range of $91,600 - $137,400 and generous benefits including 401k matching and comprehensive health coverage. #J-18808-Ljbffr