Principal Package Layout Engineer – 2.5D/3D IC Packaging

A leading technology company is looking for a Principal Package Layout Engineer to join their System-in-Package team. This role involves creating complex design layouts, collaborating with global teams, and ensuring efficient power delivery networks. Candidates should possess an Electrical Engineering degree and extensive experience with 2.5D and 3D package systems, particularly using Cadence APD and Allegro toolsets. This position offers a competitive salary range of $241,100-$326,100 per year and a flexible hybrid working environment. #J-18808-Ljbffr