Postdoc: Reliability & Advanced Semiconductor Packaging

A leading university seeks a Ph.D. qualified Research Associate for a project focused on reliability testing and modeling in semiconductor packaging. The role involves advanced technical work in collaboration with NIST, conducting experiments to evaluate polymer properties under environmental stresses and contributing to scientific research outputs. Candidates must demonstrate expertise in polymer degradation and failure analysis, preparing research findings for publication and presentations. Join a dynamic team in advancing the semiconductor industry. #J-18808-Ljbffr