Postdoc: AI/ML for Digital Twins in Semiconductors

A leading semiconductor research institute in Austin is seeking a Postdoctoral Fellow to conduct research in AI and Machine Learning for advanced packaging technologies. This role includes developing modeling for thermomechanical effects and collaborating with various teams on innovative projects. Candidates should have a Ph.D. in a relevant field, experience in data analytics, and familiarity with cutting-edge AI software. Competitive pay of $70,000+ based on qualifications, along with numerous employee benefits and professional development opportunities. #J-18808-Ljbffr