Senior Packaging Engineer — FC-CSP/PoP & SiP Expert

A leading technology firm is seeking an experienced Packaging Engineer to drive development and high-volume manufacturing of cutting-edge packaging technologies. The ideal candidate will have over 10 years in semiconductor packaging, experience with IC package development, and a relevant bachelor's degree. Responsibilities include working with internal design teams, managing complex processes, and interfacing with suppliers. This position is crucial for advancing innovative packaging solutions within the organization. #J-18808-Ljbffr