Astranis Space Technologies
Senior Mechanical Engineer- RF Packaging
Astranis Space Technologies, San Francisco, California, United States
Senior Mechanical Engineer – RF Packaging
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Senior Mechanical Engineer – RF Packaging
role at
Astranis Space Technologies .
Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today, Astranis satellites provide dedicated, secure networks to highly sophisticated customers across the globe – large enterprises, sovereign governments, and the US military. With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts.
Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization. Astranis has raised over $750 million from some of the world’s best investors, employs a team of 450 engineers, and designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California.
Role
Complete ownership of product outcomes for spaceflight hardware, focusing on high frequency active and passive RF and digital electronics.
Develop requirements for subsystems and components including loads, interfaces, and functional requirements.
Perform mechanical design and analysis of complex electronics enclosures to satisfy launch and on-orbit requirements.
Develop and define design best practices for future programs.
Manage system level schedule and integration requirements for your components while working with the Assembly, Integration, and Test team to enable a smooth build process.
Assist in recruiting, interviewing, and hiring additional teammates.
Responsibility In addition to your ownership role, you will mentor and train junior mechanical engineers on such projects. You should have a strong problem‑solving background, hands‑on testing skills, and preferably some experience with spacecraft and/or aerospace engineering.
Requirements
B.S. or M.S. in mechanical, electrical, aerospace engineering, or equivalent.
4–15+ years of mechanical design or equivalent experience.
3+ years designing, analyzing, and testing active or passive high‑frequency RF electronics packages.
Familiarity with chip and wire and splitblock construction.
Strong CAD design and finite element analysis skills.
Experience with GD&T and designing for manufacturability.
Demonstrated ability to personally design, evaluate, and procure complex mechanical assemblies with 30‑40 components in aerospace or similar.
A passion for hardware development in a fast‑paced environment.
A motivated leader who has mentored and supported junior engineers.
Don’t meet all these; we encourage you to apply.
Bonus
Experience with Ku, Ka, and Q/V band electronics package development for space missions.
Experience with thermal analysis and thermal management techniques for RF electronics in space, including heat pipes.
Experience with vibration environments and mechanical testing on spacecraft components.
Experience with brazed construction techniques for RF packages.
Experience in synthesizing requirements and flowing them down to sub‑scale verification builds and testing.
What we offer All positions offer a compensation package that includes equity and robust benefits. Base pay ranges from $145,000—$195,000 USD, plus company‑subsidized healthcare, disability and life insurance, flexible PTO, 401(K), and free on‑site catered meals.
Eligibility Requirement U.S. citizenship, lawful permanent residency, or refugee/asylee status is required to comply with U.S. Government space technology export regulations.
Diversity and Inclusion Our mission is to connect the world and welcomes all people regardless of gender, race, creed, or any other distinction. We encourage everyone to join and bring their unique perspective to strengthen us.
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Senior Mechanical Engineer – RF Packaging
role at
Astranis Space Technologies .
Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today, Astranis satellites provide dedicated, secure networks to highly sophisticated customers across the globe – large enterprises, sovereign governments, and the US military. With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts.
Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization. Astranis has raised over $750 million from some of the world’s best investors, employs a team of 450 engineers, and designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California.
Role
Complete ownership of product outcomes for spaceflight hardware, focusing on high frequency active and passive RF and digital electronics.
Develop requirements for subsystems and components including loads, interfaces, and functional requirements.
Perform mechanical design and analysis of complex electronics enclosures to satisfy launch and on-orbit requirements.
Develop and define design best practices for future programs.
Manage system level schedule and integration requirements for your components while working with the Assembly, Integration, and Test team to enable a smooth build process.
Assist in recruiting, interviewing, and hiring additional teammates.
Responsibility In addition to your ownership role, you will mentor and train junior mechanical engineers on such projects. You should have a strong problem‑solving background, hands‑on testing skills, and preferably some experience with spacecraft and/or aerospace engineering.
Requirements
B.S. or M.S. in mechanical, electrical, aerospace engineering, or equivalent.
4–15+ years of mechanical design or equivalent experience.
3+ years designing, analyzing, and testing active or passive high‑frequency RF electronics packages.
Familiarity with chip and wire and splitblock construction.
Strong CAD design and finite element analysis skills.
Experience with GD&T and designing for manufacturability.
Demonstrated ability to personally design, evaluate, and procure complex mechanical assemblies with 30‑40 components in aerospace or similar.
A passion for hardware development in a fast‑paced environment.
A motivated leader who has mentored and supported junior engineers.
Don’t meet all these; we encourage you to apply.
Bonus
Experience with Ku, Ka, and Q/V band electronics package development for space missions.
Experience with thermal analysis and thermal management techniques for RF electronics in space, including heat pipes.
Experience with vibration environments and mechanical testing on spacecraft components.
Experience with brazed construction techniques for RF packages.
Experience in synthesizing requirements and flowing them down to sub‑scale verification builds and testing.
What we offer All positions offer a compensation package that includes equity and robust benefits. Base pay ranges from $145,000—$195,000 USD, plus company‑subsidized healthcare, disability and life insurance, flexible PTO, 401(K), and free on‑site catered meals.
Eligibility Requirement U.S. citizenship, lawful permanent residency, or refugee/asylee status is required to comply with U.S. Government space technology export regulations.
Diversity and Inclusion Our mission is to connect the world and welcomes all people regardless of gender, race, creed, or any other distinction. We encourage everyone to join and bring their unique perspective to strengthen us.
#J-18808-Ljbffr