Senior AI Packaging Engineer - 2.5D/3D Interposers

A cutting-edge technology firm in San Jose is looking for a Senior Packaging Engineer to drive state-of-the-art substrate designs for AI applications. The ideal candidate will have over 7 years of semiconductor packaging experience and a BS/MS in Electrical Engineering. Key responsibilities include leading DFM reviews, designing advanced interposers, and collaborating with silicon and hardware teams. Competitive salary and flexible PTO are offered.
#J-18808-Ljbffr