PAT Team Lead: Device Packaging, Assembly & Test (Asia)

A leading technology company is seeking an experienced Engineering Lead to manage device packaging and test engineering in Sunnyvale, California. The candidate will lead operations in Asia, implement wafer level tests, and improve device packaging processes. A bachelor's degree and 12 years of experience are required, with a preference for advanced degrees and experience in optoelectronic device tests. Competitive salary and comprehensive benefits are offered, alongside a collaborative work environment. #J-18808-Ljbffr