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Director of Packaging Engineering – Consumer Electronics

Shanghai BSF Human Resources Co., Ltd, San Jose, California, United States

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A recruitment firm is seeking a Head of Consumer Electronics Packaging Engineering to lead process improvement and technology implementation. The ideal candidate will have over 10 years of experience in package development within the consumer electronics sector and familiarity with Apple's products. This role involves technical management, project leadership, and strategic planning while requiring relocation to China for long-term commitment. #J-18808-Ljbffr