Senior Packaging Engineer — Advanced Semiconductor Modules

A technology leader in material engineering is seeking a Packaging Engineer in Santa Clara, CA. The successful candidate will manage customer engagements, develop new modules in semiconductor packaging, and file patentable developments. Candidates should possess an MS or PhD in relevant engineering fields and have expertise in wafer bonding and packaging innovations. This role offers a full-time position with a salary range of $154,000.00 - $212,000.00, as well as opportunities for professional growth and a supportive work culture. #J-18808-Ljbffr