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Lead PCB Packaging Modeling Architect

AMD, Austin, Texas, us, 78716

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A leading semiconductor company is seeking a PCB-centric Mechanical Modeling Architect in Austin, Texas. The role requires expertise in model-based architecture and mechanical modeling to guide next-generation packaging-platform architectures for critical computing systems. Ideal candidates possess strong communication skills and a proven background in advanced PCB technologies. Join a collaborative team focused on innovative computing solutions and shaping the future of AI and technology. #J-18808-Ljbffr