Senior Microelectronics Technologist — 3D Packaging Lead

A global technology manufacturer located in Syracuse is seeking a Sr Technologist in Microelectronics to lead technology development in advanced packaging solutions. This role involves providing technical leadership, mentoring engineering teams, and collaborating on innovative product development. Ideal candidates should have a strong background in microelectronics, advanced manufacturing techniques, and possess a minimum of 20 years of relevant experience in the field. The position offers competitive compensation and a comprehensive benefits package. #J-18808-Ljbffr