Broadcom Inc. is seeking an Advanced Package Technology Engineer to develop cost-effective, high-performance 2.5D/3D packaging solutions.
The role involves close collaboration with silicon, packaging, design, and supplier teams to meet ambitious timelines and performance goals. The candidate should have hands-on 4–6 years in 2.5D/3D development, strong knowledge of substrates, interposers, and related processes, and proven project management and collaboration skills.
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