EM Modeling / Package Designer Job at Otava RF in Moorestown Township
Otava RF, Moorestown Township, NJ, United States
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Location: New Jersey Area (hybrid), New England Area (fully remote)
Employment: Full-Time
If interested please send your resume to careers@otava-rf.com with EM in the subject line.
Job Overview:
Otava Inc., based in Moorestown, New Jersey, is a fabless semiconductor company specializing in RF and millimeter-wave technologies. Our mission is to provide cutting-edge radio frequency integrated solutions for emerging defense, 5G/6G, and satellite communication applications. As a small and growing company, we concentrate on developing high-performance, wideband chips and system-on-chip (SoC) solutions.
We are seeking an enthusiastic and collaborative EM / Package Design Engineer to join our dynamic team. The ideal candidate will possess a strong technical background in RF and Microwave Electromagnetic analysis as well as some experience with package design and layout. This position requires excellent communication skills and a self-driven mindset, presenting significant opportunities for professional development and career advancement.
Key Responsibilities:
Electromagnetic analysis of 2.5D and 3D microelectronic packages
Design and layout of multi-chip packages in Allegro Package Designer
Organize and present clear technical results during design reviews
Qualifications:
- MSEE or PhD in Electrical Engineering (required)
- Graduate school experience or 3+ years of industry experience in EM modeling or IC design with an interest in EM modeling
- Experienced with 3D electromagnetic solvers, such as HFSS
- Experienced with Cadence Virtuoso Schematic and Layout design flow.
- Strong team player mindset, driven to overcome design challenges, learn and succeed
- U.S. citizenship or Green Card holder (required)
Seniority level
Seniority level
Entry level
Employment type
Employment type
Full-time
Job function
Job function
Design, Art/Creative, and Information TechnologyIndustries
Semiconductor Manufacturing
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