Data Device
IC Package Designer
Department:Engineer
Location:Bohemia, NY
For more than 60 years, Data Device Corporation (DDC) has been recognized as a world leader in the design and manufacture of high-reliability Connectivity, Power, and Control solutions for the Aerospace, Defense, and Space industries. Our dedication to supplying quality products, on-time delivery, and superior support, has contributed to the success of our customers and the critical missions they serve.
Pay range for this position is between $130,000 and $170,000 annually and will depend upon experience.
This position is 100% onsite at our Bohemia, NY office.
This position requires a U.S Person or a person who can qualify for a department of state or commercial license.
Position Summary:
We are seeking a skilled and detail-oriented IC Package Designer to join our engineering team. The ideal candidate will have in-depth knowledge of substrate design, package layout, signal integrity, and manufacturing constraints. This role will collaborate cross-functionality with the electrical, mechanical and manufacturing design teams to develop reliable, manufacturable, and cost-effective package design.
Design and Development:Lead the interconnect design for advanced electronic packaging solutions, including high-reliability flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures.
Verification and Validation:Perform comprehensive design verification ensuring that the package design meets all functional, electrical, thermal, mechanical, and manufacturability requirements
Collaboration:Collaborate closely with substrate, material and package suppliers to align design with process capabilities and technologies to ensure design meets electrical and mechanical performance requirements.
Troubleshooting: Support Failure Analysis (FA) and root cause investigations related to the design, assembly, or performance of a package or substrate.
Optimization: Define and develop substrate stack-ups, routing strategies, via structures, and component placement to meet electrical and mechanical specifications.
Documentation:Maintain thorough documentation of design processes, test results, and revisions to ensure clarity and consistency for release packages for manufacturing.
Planning:Develop plans, schedules, and support technical reviews that are required to develop products from market requirement through product release.
Mentorship:Provide guidance and support to junior engineers, sharing expertise and best practices in package design and development.
Continuous Improvement:Contribute to package technology roadmap and design methodology improvements.
Qualifications:
Education: Bachelor-s degree in Electrical Engineering, Material science or related field.
Experience: 8+ years of experience in IC package design and development
Tool Skills: Experience with package design tools from concept through release (e.g., Cadence Allegro package designer).
Technical Skills:Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs).
Knowledge: Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes.
Problem-Solving: Excellent analytical and troubleshooting skills with a keen eye for detail.
Communication: Strong verbal and written communication skills, with the ability to work effectively in a team-oriented environment.
Desired Characteristics
Experience collaborating with OSATs and semiconductor foundries, including qualification and design feedback loops
Knowledge of high-speed digital interfaces (PCIe, DDR, SerDes, etc.).
Knowledge with package-level simulation tools to analyze signal quality and timing through package interconnects.
Experience with defense packaging techniques for extreme environmental conditions .
Data Device Corporation is an Affirmative Action/Equal Opportunity Employer and is committed to providing equal employment opportunity (EEO) for all persons in all facets of employment. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, gender, sexual orientation, gender identity, national origin, citizenship status, marital status, genetic information, disability, protected veteran status or any other legally protected status.
Department:Engineer
Location:Bohemia, NY
For more than 60 years, Data Device Corporation (DDC) has been recognized as a world leader in the design and manufacture of high-reliability Connectivity, Power, and Control solutions for the Aerospace, Defense, and Space industries. Our dedication to supplying quality products, on-time delivery, and superior support, has contributed to the success of our customers and the critical missions they serve.
Pay range for this position is between $130,000 and $170,000 annually and will depend upon experience.
This position is 100% onsite at our Bohemia, NY office.
This position requires a U.S Person or a person who can qualify for a department of state or commercial license.
Position Summary:
We are seeking a skilled and detail-oriented IC Package Designer to join our engineering team. The ideal candidate will have in-depth knowledge of substrate design, package layout, signal integrity, and manufacturing constraints. This role will collaborate cross-functionality with the electrical, mechanical and manufacturing design teams to develop reliable, manufacturable, and cost-effective package design.
Design and Development:Lead the interconnect design for advanced electronic packaging solutions, including high-reliability flip-chip BGA, ceramic packages, multi-chip modules (MCMs), and system-in-package (SiP) architectures.
Verification and Validation:Perform comprehensive design verification ensuring that the package design meets all functional, electrical, thermal, mechanical, and manufacturability requirements
Collaboration:Collaborate closely with substrate, material and package suppliers to align design with process capabilities and technologies to ensure design meets electrical and mechanical performance requirements.
Troubleshooting: Support Failure Analysis (FA) and root cause investigations related to the design, assembly, or performance of a package or substrate.
Optimization: Define and develop substrate stack-ups, routing strategies, via structures, and component placement to meet electrical and mechanical specifications.
Documentation:Maintain thorough documentation of design processes, test results, and revisions to ensure clarity and consistency for release packages for manufacturing.
Planning:Develop plans, schedules, and support technical reviews that are required to develop products from market requirement through product release.
Mentorship:Provide guidance and support to junior engineers, sharing expertise and best practices in package design and development.
Continuous Improvement:Contribute to package technology roadmap and design methodology improvements.
Qualifications:
Education: Bachelor-s degree in Electrical Engineering, Material science or related field.
Experience: 8+ years of experience in IC package design and development
Tool Skills: Experience with package design tools from concept through release (e.g., Cadence Allegro package designer).
Technical Skills:Proven experience with advanced packaging technologies (e.g., 2.5D/3D, redistribution layer, interposers, HBM integration, Package-in-Package, Fan-Out Wafer Level Packaging, wire bonded, Flip Chip, stacked die using DAF or FOW, Chip-on-Wafer-on-Substrate, Ceramic Co-Fire, Printed Substrate in ceramic package, plastic encapsulated modules/BGAs).
Knowledge: Strong understanding of substrate technologies (e.g., BT laminate, ABF, BeO, PTFE, KPPE, glass cloth resin), materials and manufacturing processes.
Problem-Solving: Excellent analytical and troubleshooting skills with a keen eye for detail.
Communication: Strong verbal and written communication skills, with the ability to work effectively in a team-oriented environment.
Desired Characteristics
Experience collaborating with OSATs and semiconductor foundries, including qualification and design feedback loops
Knowledge of high-speed digital interfaces (PCIe, DDR, SerDes, etc.).
Knowledge with package-level simulation tools to analyze signal quality and timing through package interconnects.
Experience with defense packaging techniques for extreme environmental conditions .
Data Device Corporation is an Affirmative Action/Equal Opportunity Employer and is committed to providing equal employment opportunity (EEO) for all persons in all facets of employment. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, gender, sexual orientation, gender identity, national origin, citizenship status, marital status, genetic information, disability, protected veteran status or any other legally protected status.