eTeam
IC Packaging & Chiplet Integration
: 2.5D/3D packaging, flip-chip bonding, TSV, hybrid bonding Semiconductor Processing
: BEOL/FEOL integration, advanced interconnects, thin-film deposition (PVD, PECVD, ALD, CVD) Design & Simulation
:
Siemens NX, Cadence, ANSYS, EasyEDA, ThermoCalc High-Speed I/O & Signal Integrity
: Impedance control, power/signal integrity, substrate optimization Process Development & Metrology
: DOE, SPC, FMEA, SEM, TEM, AFM, Raman spectroscopy Cross-Functional Collaboration
: Foundry/OSAT coordination, ASIC design support, product lifecycle management
: 2.5D/3D packaging, flip-chip bonding, TSV, hybrid bonding Semiconductor Processing
: BEOL/FEOL integration, advanced interconnects, thin-film deposition (PVD, PECVD, ALD, CVD) Design & Simulation
:
Siemens NX, Cadence, ANSYS, EasyEDA, ThermoCalc High-Speed I/O & Signal Integrity
: Impedance control, power/signal integrity, substrate optimization Process Development & Metrology
: DOE, SPC, FMEA, SEM, TEM, AFM, Raman spectroscopy Cross-Functional Collaboration
: Foundry/OSAT coordination, ASIC design support, product lifecycle management