HBM Design Architect - 3D Packaging & Nanotech Lead

A leading semiconductor company located in Texas is looking for a highly skilled HBM Design Architect. This role focuses on the design and integration of advanced DRAM technologies for next-generation AI and data-intensive systems. Candidates should have over 10 years of experience in engineering/design, with expertise in nanometer CMOS, DRAM architecture, and 3D integration. Comprehensive benefits are included, along with opportunities for professional growth in nanotechnology. #J-18808-Ljbffr