FO-WLP Packaging Sales Leader for HPC/AI Platforms (Hybrid)

A leading technology firm in New York seeks a Fan-Out Wafer Level Packaging Executive Focal Point. The role involves overseeing business development efforts in FO-WLP technology. Candidates should have a bachelor's degree in Engineering or Technology and significant experience in the semiconductor industry, particularly in advanced packaging. This hybrid position offers competitive salary ranging from $185,000 to $318,000 depending on skills and experience. #J-18808-Ljbffr