Senior Packaging Design Engineer (3DIC) - Hybrid Role

A leading semiconductor manufacturer in Phoenix seeks a Senior Silicon Application Engineer (Packaging Design) to lead technical efforts in advanced packaging technologies. This role involves working with customers to define and develop design tools, ensuring successful product adoption. Candidates should have a bachelor's degree in a relevant field and over 7 years of experience in package design. The position offers a competitive salary, professional development opportunities, and the flexibility of a hybrid work model. #J-18808-Ljbffr