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Intel Corporation

Senior Packaging Design Engineer (3DIC) - Hybrid Role

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading technology company is looking for a Senior Silicon Application Engineer (Packaging Design) in Phoenix, Arizona. This position involves advanced packaging technologies and working closely with foundry customers on design tools and methodologies. The ideal candidate should have a Bachelor's degree in Electrical or Computer Engineering and over 7 years of relevant experience. The role offers opportunities to lead technical engagements and engage directly with customers while collaborating across teams to solve design challenges. A competitive salary and hybrid work model are included. #J-18808-Ljbffr