
Semiconductor Packaging Mechanical Engineer - Multiphysics
Intel Corporation, Phoenix, Arizona, United States, 85003
A leading semiconductor company seeks a Semiconductor Packaging Mechanical Engineer to join their team in Phoenix, Arizona. The role focuses on developing multiphysics simulations for advanced semiconductor packaging, requiring a Master's or PhD in Mechanical Engineering, Chemical Engineering, or related fields. Candidates should have experience in finite element analysis and the ability to collaborate across teams. The job offers competitive compensation and requires on-site presence.
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