
Semiconductor Packaging Mechanical Engineer - Multiphysics
Intel Corporation, Phoenix, Arizona, United States, 85003
A leading semiconductor company is seeking a Semiconductor Packaging Mechanical Engineer in Phoenix, Arizona. This role involves developing and validating simulations for advanced semiconductor packaging, collaborating with teams on design and testing, and requires a Master's or PhD in Mechanical Engineering or a related field. Ideal candidates will have experience in multi-physics simulations and strong programming skills. On-site presence is required for this innovative position.
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