
Director, Semiconductor Packaging & Customer Growth
Semiconductor Engineering, Tempe, Arizona, us, 85285
A leading semiconductor company is seeking a Director for the Wafer Services Business Unit in Tempe, AZ. This customer-facing role requires extensive experience in semiconductor manufacturing, project management, and excellent communication skills. The candidate will oversee wafer bumping technologies, drive customer revenue, and manage customer expectations in a hybrid work environment. A Bachelor's degree in Engineering or Science and a minimum of 10 years’ relevant experience are required.
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