Mechanical Engineer: Semiconductor Packaging & TSV

A semiconductor startup is seeking a qualified candidate to work on mechanical designs for advanced electronic packaging with Integrated Circuits. The role requires a strong background in packaging for Semiconductor Integrated Circuits, proficiency in Solidworks or similar design packages, and experience with FEA and thermal analysis. If you have relevant educational credentials and expertise in 2.5D or 3D Packaging, we encourage you to apply. Located on-site in San Jose, CA. #J-18808-Ljbffr