Senior Packaging Engineer 3D/TSV, Equity

A leading semiconductor startup in San Jose is seeking a Senior Packaging Engineer to work on mechanical designs for advanced electronic packaging. This position requires a B.S. or M.S. in a related engineering field and knowledge in Solidworks, FEA tools, and packaging standards. Ideal candidates will have experience with 2.5D/3D packaging and TSV. The company offers a variety of benefits, including 401K, bonuses, and full premium healthcare. #J-18808-Ljbffr