Senior Substrate Design Layout Engineer
Piper Companies, Saratoga, CA, United States
Piper Companies is seeking a
Senior Substrate Design Layout Engineer
to support an industry‑leading semiconductor organization for a
permanent ,
onsite
opportunity based in
Saratoga, CA . The
Senior Substrate Design Layout Engineer
will contribute to the development and layout of cutting‑edge organic substrate solutions for next‑generation multi‑die and chiplet computing platforms.
Responsibilities
Lead detailed layout activities for complex organic substrates, including bump planning, routing schemes, and multilayer stack‑up development.
Define routing and power‑delivery strategies that support high‑speed interfaces and high‑current architectures across advanced package substrates.
Collaborate closely with integration, silicon, SI/PI, and mechanical teams to ensure cohesive co‑design and layout feasibility.
Evaluate design risks early in development and recommend layout‑driven improvements to meet electrical, mechanical, and manufacturability constraints.
Interface with substrate suppliers and OSAT partners to validate design readiness, manufacturability, and overall yield performance.
Qualifications
10+ years of experience in advanced organic substrate design or high‑performance IC package layout.
Background working with multi‑die, chiplet, or high‑density module architectures using ABF and multilayer organic technologies.
Proficiency in Siemens Xpedition (preferred) and experience with tools such as Cadence Allegro/APD.
Hands‑on experience collaborating with OSATs and global substrate vendors, including driving designs through tape‑out.
Strong understanding of SI/PI concepts, HDI structures, and routing practices supporting high‑speed signals and advanced power delivery networks.
Compensation Salary Range: $235,000-$265,000/year (USD)
Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K
This job opens for applications on 3/6/26. Applications for this job will be accepted for at least 30 days from the posting date.
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Senior Substrate Design Layout Engineer
to support an industry‑leading semiconductor organization for a
permanent ,
onsite
opportunity based in
Saratoga, CA . The
Senior Substrate Design Layout Engineer
will contribute to the development and layout of cutting‑edge organic substrate solutions for next‑generation multi‑die and chiplet computing platforms.
Responsibilities
Lead detailed layout activities for complex organic substrates, including bump planning, routing schemes, and multilayer stack‑up development.
Define routing and power‑delivery strategies that support high‑speed interfaces and high‑current architectures across advanced package substrates.
Collaborate closely with integration, silicon, SI/PI, and mechanical teams to ensure cohesive co‑design and layout feasibility.
Evaluate design risks early in development and recommend layout‑driven improvements to meet electrical, mechanical, and manufacturability constraints.
Interface with substrate suppliers and OSAT partners to validate design readiness, manufacturability, and overall yield performance.
Qualifications
10+ years of experience in advanced organic substrate design or high‑performance IC package layout.
Background working with multi‑die, chiplet, or high‑density module architectures using ABF and multilayer organic technologies.
Proficiency in Siemens Xpedition (preferred) and experience with tools such as Cadence Allegro/APD.
Hands‑on experience collaborating with OSATs and global substrate vendors, including driving designs through tape‑out.
Strong understanding of SI/PI concepts, HDI structures, and routing practices supporting high‑speed signals and advanced power delivery networks.
Compensation Salary Range: $235,000-$265,000/year (USD)
Comprehensive Benefits: Medical, Dental, Vision, sick leave if required by law, and 401K
This job opens for applications on 3/6/26. Applications for this job will be accepted for at least 30 days from the posting date.
#J-18808-Ljbffr