Director, Chiplet Packaging & FCBGA Programs

A leading semiconductor company is seeking a Business Unit Product Manager for Advanced FCBGA Packaging in Tempe, AZ. The role involves managing customer accounts, driving internal process developments, and supporting product qualification and mass production. Ideal candidates should have a Bachelor's in Engineering and over 10 years of industry experience, particularly in semiconductor packaging, along with strong program management skills. The position offers a hybrid work schedule. #J-18808-Ljbffr