Engineer II - Florida Semiconductor Institute (FSI)
University Of Florida, Gainesville, FL, United States
Engineer II - Florida Semiconductor Institute (FSI)
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Job no:
539221 Work type:
Staff Full-Time Location:
Main Campus (Gainesville, FL) Categories:
Grant or Research Administration, Engineering Department:
19050500 - EG-SEMICONDUCTORS
Classification Title:
A high school diploma or equivalent and six years of relevant experience; Appropriate college coursework or vocational/technical training may substitute at an equivalent rate for the required experience; or Bachelor's degree in an appropriate area and two years of relevant experience.
Operate laboratory equipment in line with the FSI research projects and service agreements and packaging development initiatives as needed. Equipment includes etching, dicing, packaging, thermal testing, X‑ray tomography, dual beam FIB/SEM, scanning acoustic microscope, digital microscope, probe station, sample preparation, optical microscope, and others. Optimize workflows for reliability studies and ensure compliance with industry standards in packaging technologies.
Monitor, maintain, calibrate, and troubleshoot laboratory and mechanical room equipment. Communicate infrastructure changes and updates in lab and mechanical room facilities (vacuum pumps, air compressors, water chillers, etc.) and keep the laboratory and mechanical room secure and well‑organized. Order necessary parts and consumables for assigned labs and work closely with vendors on competitive pricing.
Lead data collection and management for projects, following guidelines and project restrictions.
Train new users, including undergraduate and graduate students, postdoctoral associates, and professional engineers, on proper use of equipment and lab procedures. Coordinate and instruct graduate engineers in laboratory equipment operations and functions and manage lab access and security camera footage review.
Research and study new tools and methods to keep equipment up‑to‑date with evolving test and measurement capabilities. Provide consultation and assistance to faculty and others in the use of the laboratory.
Perform tasks for the FSI research laboratory and collaborate internally and externally. Assist faculty and other FSI researchers in collecting data and writing sponsored research reports and technical papers for publication and/or presentation.
Salary: $75,000–$95,000; commensurate with education and experience.
Required Qualifications:
High school diploma or equivalent and six years of relevant experience;
or Appropriate college coursework or vocational/technical training at an equivalent rate;
or Bachelor's degree in an appropriate area and two years of relevant experience.
Preferred:
B.S. in electrical engineering, mechanical engineering, materials science or other relevant disciplines.
Experience with IC packaging and advanced packaging.
Microelectronics and semiconductor fabrication knowledge.
Hands‑on processing, metrology, reliability, and failure analysis experience.
Operating semiconductor fabrication and reliability test tools (thermal, stress, humidity, etc.).
Direct experience in operating lab equipment and general lab management.
Experience with 3D image analysis software (VisualSI, ImageJ, Avizo, ORS, etc.).
Special Instructions to Applicants:
Submit a cover letter and resume. This is a time‑limited position. Application must be submitted by 11:55 p.m. (ET) of the posting end date.
Advertised:
19 Mar 2026 Eastern Daylight Time Applications close:
02 Apr 2026 Eastern Daylight Time
The University of Florida is an Equal Employment Opportunity Employer.
#J-18808-Ljbffr
Job no:
539221 Work type:
Staff Full-Time Location:
Main Campus (Gainesville, FL) Categories:
Grant or Research Administration, Engineering Department:
19050500 - EG-SEMICONDUCTORS
Classification Title:
A high school diploma or equivalent and six years of relevant experience; Appropriate college coursework or vocational/technical training may substitute at an equivalent rate for the required experience; or Bachelor's degree in an appropriate area and two years of relevant experience.
Operate laboratory equipment in line with the FSI research projects and service agreements and packaging development initiatives as needed. Equipment includes etching, dicing, packaging, thermal testing, X‑ray tomography, dual beam FIB/SEM, scanning acoustic microscope, digital microscope, probe station, sample preparation, optical microscope, and others. Optimize workflows for reliability studies and ensure compliance with industry standards in packaging technologies.
Monitor, maintain, calibrate, and troubleshoot laboratory and mechanical room equipment. Communicate infrastructure changes and updates in lab and mechanical room facilities (vacuum pumps, air compressors, water chillers, etc.) and keep the laboratory and mechanical room secure and well‑organized. Order necessary parts and consumables for assigned labs and work closely with vendors on competitive pricing.
Lead data collection and management for projects, following guidelines and project restrictions.
Train new users, including undergraduate and graduate students, postdoctoral associates, and professional engineers, on proper use of equipment and lab procedures. Coordinate and instruct graduate engineers in laboratory equipment operations and functions and manage lab access and security camera footage review.
Research and study new tools and methods to keep equipment up‑to‑date with evolving test and measurement capabilities. Provide consultation and assistance to faculty and others in the use of the laboratory.
Perform tasks for the FSI research laboratory and collaborate internally and externally. Assist faculty and other FSI researchers in collecting data and writing sponsored research reports and technical papers for publication and/or presentation.
Salary: $75,000–$95,000; commensurate with education and experience.
Required Qualifications:
High school diploma or equivalent and six years of relevant experience;
or Appropriate college coursework or vocational/technical training at an equivalent rate;
or Bachelor's degree in an appropriate area and two years of relevant experience.
Preferred:
B.S. in electrical engineering, mechanical engineering, materials science or other relevant disciplines.
Experience with IC packaging and advanced packaging.
Microelectronics and semiconductor fabrication knowledge.
Hands‑on processing, metrology, reliability, and failure analysis experience.
Operating semiconductor fabrication and reliability test tools (thermal, stress, humidity, etc.).
Direct experience in operating lab equipment and general lab management.
Experience with 3D image analysis software (VisualSI, ImageJ, Avizo, ORS, etc.).
Special Instructions to Applicants:
Submit a cover letter and resume. This is a time‑limited position. Application must be submitted by 11:55 p.m. (ET) of the posting end date.
Advertised:
19 Mar 2026 Eastern Daylight Time Applications close:
02 Apr 2026 Eastern Daylight Time
The University of Florida is an Equal Employment Opportunity Employer.
#J-18808-Ljbffr