Senior Layout Engineer, HBM Richardson, Texas, United States of America

## Senior Layout Engineer, HBMRichardson, Texas, United States of America**Our vision is to transform how the world uses information to enrich life for *all*.**Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.## ResponsibilitiesAs a Senior Layout Engineer at Micron, you will play a pivotal role in developing our innovative HBM components. This ambitious role requires you to:* Perform block-level and top-level layout for high-bandwidth memory (HBM) components.* Support advanced technology nodes and HBM-specific build rules during layout development.* Implement layouts for 2.5D and 3D integration, including through-silicon vias (TSVs), micro-bump arrays, keep-out zones, alignment constraints, and interposer or die-to-die interfaces.* Run and debug design-rule checking (DRC), layout versus schematic (LVS), electrical-rule checking (ERC), and density checks to achieve clean signoff.* Support and interpret parasitic extraction (PEX) or equivalent experience, electromigration and voltage-drop (EM/IR) analysis, and reliability checks; implement required layout updates.* Ensure compliance with foundry build rules, reliability guidelines, and process constraints.* Collaborate with analog and mixed-signal designers to refine floorplans and address performance or layout tradeoffs.* Partner with physical build, packaging, and signal-integrity (SI) teams on top-level integration, pin assignment, and power distribution.## Minimum QualificationsWe are looking for candidates who bring the following to our team:* Bachelor’s or Master’s degree in Electrical Engineering or a related field, or equivalent practical experience.* 8+ years of experience in custom analog or mixed-signal coordinated circuit (IC) layout.* Understanding of noise coupling, substrate effects, and power-integrity considerations.* Familiarity with advanced process nodes such as fin field-effect transistor (FinFET) or deep-submicron complementary metal-oxide-semiconductor (CMOS).* Ability to independently own layout blocks from floorplanning through tape-out.## Preferred QualificationsIdeal candidates will have:* Experience supporting 2.5D or 3D integration flows for HBM or similar high-density technologies.* Background working with TSVs, micro-bumps, and interposer-based layouts.* Practice coordinating with cross-functional teams across packaging, physical build, and signal-integrity workflows.* Experience delivering layout for advanced-node builds with reliability and signoff requirements.Join us in our mission to successfully implement world-class memory solutions that transform information into intelligence!As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. 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