Senior IC Packaging Layout Engineer — Remote | Power Integrity & SI

A leading semiconductor company is seeking a Sr IC Packaging Layout Specialist with substantial experience in package layout and electrical analysis. This remote role requires expertise in power distribution and high-frequency signal integrity. Ideal candidates will have over 10 years of experience and hands-on skills with tools like Cadence APD and Ansys HFSS. The anticipated salary ranges from $150,000 to $165,000, complemented by comprehensive benefits including PTO and medical coverage. #J-18808-Ljbffr