Sr IC Packaging Layout Specialist – (100% Remote)
Encore Semi, Inc., Clifton, NJ, United States
Sr ASIC Packaging Engineer – (100% Remote)
We are seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. You will own the "silicon-to-board" interface, ensuring that advanced ASIC designs meet stringent signal integrity, thermal, and reliability requirements through expert simulation and innovative manufacturing.
Location: Remote (anywhere in US)
Full-time: Salary + Benefits + Bonuses / Contractor
Work Status: US Citizen or Lawful Permanent Resident.
Responsibilities
EM & Signal Integrity: Lead full-wave 3D electromagnetic simulations using ANSYS HFSS for ASIC package extractions. Optimize bump-to-ball transitions and high-speed SerDes paths using Agilent ADS.
Package Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip‑Chip BGA, and Fan‑Out Wafer‑Level Packaging (FOWLP).
Integration & Test (I&T): Drive the Integration and Test phase by correlating simulation models with physical hardware measurements (VNA/TDR). Validate package‑level power delivery networks (PDN).
Prototyping & Additive: Utilize Additive Manufacturing to develop custom heat sinks, interposers, or rapid‑prototype substrates, reducing the R&D cycle for complex ASIC form factors.
Required Skills
10+ years in Electronics Packaging, specifically focused on high‑bump‑count ASICs and high‑speed interfaces.
Expert proficiency in ANSYS HFSS and Agilent ADS for package‑level SI/PI analysis.
Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry.
B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science.
The anticipated annual base salary for this position is between $135,000 to $150,000, which also includes a comprehensive benefits package.
Full-Time Benefits
15 days of PTO per calendar year
10 paid Holidays per calendar year
Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
Dental & Vision: Company covers 50% of premiums for Employee and Dependents
Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
Employee Assistant Program (EAP)
401k - Traditional & Roth
Life/AD&D and Long-Term Disability
Tuition reimbursement
Equal Opportunity Policy Statement Encore Semi, Inc. is an Equal Opportunity Employer that does not discriminate on the basis of actual or perceived race, religion, creed, color, age, sex, sexual orientation, gender, gender identity or expression, national origin, genetics, ancestry, marital status, civil union status, medical condition, disability (mental and physical), military and veteran status, pregnancy, childbirth and related medical conditions, or any other characteristic protected by applicable federal, state, or local laws and ordinances.
Encore Semi is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
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We are seeking a Sr ASIC Packaging Engineer to lead the physical architecture of high-performance silicon. You will own the "silicon-to-board" interface, ensuring that advanced ASIC designs meet stringent signal integrity, thermal, and reliability requirements through expert simulation and innovative manufacturing.
Location: Remote (anywhere in US)
Full-time: Salary + Benefits + Bonuses / Contractor
Work Status: US Citizen or Lawful Permanent Resident.
Responsibilities
EM & Signal Integrity: Lead full-wave 3D electromagnetic simulations using ANSYS HFSS for ASIC package extractions. Optimize bump-to-ball transitions and high-speed SerDes paths using Agilent ADS.
Package Architecture: Design and develop advanced ASIC packaging solutions, including 2.5D/3D IC (HBM/CoWoS), Flip‑Chip BGA, and Fan‑Out Wafer‑Level Packaging (FOWLP).
Integration & Test (I&T): Drive the Integration and Test phase by correlating simulation models with physical hardware measurements (VNA/TDR). Validate package‑level power delivery networks (PDN).
Prototyping & Additive: Utilize Additive Manufacturing to develop custom heat sinks, interposers, or rapid‑prototype substrates, reducing the R&D cycle for complex ASIC form factors.
Required Skills
10+ years in Electronics Packaging, specifically focused on high‑bump‑count ASICs and high‑speed interfaces.
Expert proficiency in ANSYS HFSS and Agilent ADS for package‑level SI/PI analysis.
Deep understanding of substrate materials (ABF, Coreless), thermal interface materials (TIMs), and underfill chemistry.
B.S./M.S. in Electrical Engineering, Mechanical Engineering, or Materials Science.
The anticipated annual base salary for this position is between $135,000 to $150,000, which also includes a comprehensive benefits package.
Full-Time Benefits
15 days of PTO per calendar year
10 paid Holidays per calendar year
Comprehensive Medical Benefits: Company covers 80% of premiums for Employee and Dependents
Dental & Vision: Company covers 50% of premiums for Employee and Dependents
Voluntary Benefits: Life Insurance, FSA (Health and Dependent, Limited Purpose), HAS, and Gap Insurance
Employee Assistant Program (EAP)
401k - Traditional & Roth
Life/AD&D and Long-Term Disability
Tuition reimbursement
Equal Opportunity Policy Statement Encore Semi, Inc. is an Equal Opportunity Employer that does not discriminate on the basis of actual or perceived race, religion, creed, color, age, sex, sexual orientation, gender, gender identity or expression, national origin, genetics, ancestry, marital status, civil union status, medical condition, disability (mental and physical), military and veteran status, pregnancy, childbirth and related medical conditions, or any other characteristic protected by applicable federal, state, or local laws and ordinances.
Encore Semi is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
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