Senior TPM: AI Cooling & Chip Packaging Lead

A leading technology company is seeking an experienced Senior Technical Program Manager to lead the AWS Advanced Cooling program in Austin, Texas. This role involves managing the evaluation and integration of next-generation cooling technologies, collaborating with engineering teams, and ensuring product innovations are ready for deployment. Candidates should have a strong background in technical product management and thermal management, with at least 5 years of relevant experience and a Bachelor's degree in engineering or computer science. #J-18808-Ljbffr