Senior 3D IC Packaging & SIP Design Lead

A leading global technology firm seeks a motivated package design lead for its 3D IC Solutions Engineering team. The ideal candidate will create comprehensive workflows and support advanced 3D System in Package designs, utilizing various EDA tools and methodologies. Strong background in package design, scripting, and verification is essential. The position offers flexible work arrangements, competitive benefits, and opportunities for personal and professional growth. #J-18808-Ljbffr