
Package Design Rule Owner - Hybrid Packaging Leader
Intel Corporation, Phoenix, AZ, United States
A leading technology company seeks an experienced Package Design Rule Owner (DRO) in Phoenix, Arizona. The role involves defining design rules for package substrate design, collaborating with product teams, and ensuring design manufacturability. Candidates should possess a Bachelor's degree in a relevant STEM field, with at least 6 years of experience in semiconductor fabrication. Strong analytical and problem-solving skills are essential. The position offers a comprehensive compensation package and a hybrid work model.
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