Hands-On Semiconductor Packaging Intern

A semiconductor startup in San Francisco is seeking Semiconductor Packaging Engineering Interns for a fall term. This hands-on role involves working on R&D for packaging technologies, integrating components, and improving fabrication processes. Candidates should be pursuing a Bachelor's in engineering and have lab experience. The internship offers a competitive pay range of $105,000-$126,000 equivalent annually, along with benefits like meals and a housing stipend. #J-18808-Ljbffr