Director, Chiplet & FCBGA Integration

A leading semiconductor solutions provider is seeking a Director, Chiplets and FCBGA, for their Tempe, AZ office. This role involves program management for advanced chiplet-based IC packages and coordinating with Tier 1 customers. Candidates should possess a Bachelor's in Engineering and over 10 years of semiconductor packaging experience. A hybrid schedule is available, and candidates must reside near the office or be willing to relocate. Strong communication and team management skills are essential. #J-18808-Ljbffr