Mechanical Simulation Engineer – Semiconductor Packaging

A leading technology company is seeking a Mechanical Simulation Engineer in Boise, ID to develop advanced HBM technologies. This role involves collaborating with global teams, performing engineering analysis, and using tools like ANSYS and Abaqus to simulate and improve packaging designs. Candidates should have a background in mechanical engineering or material science with 0-5 years of experience in the semiconductor industry. The position offers an opportunity to innovate in semiconductor packaging. #J-18808-Ljbffr