Head of Thermal-Mechanical Reliability for AI-Driven HPC

A leading technology firm in Watertown is seeking a visionary technical leader to head a division focused on 3D-IC Thermal-Mechanical Reliability. The role involves owning the technical roadmap, designing advanced simulation workflows, and collaborating with elite semiconductor companies. Candidates should have a PhD and over 10 years of experience in the semiconductor industry. Benefits include competitive compensation, health insurance, a 401(k) contribution, and a gym allowance. #J-18808-Ljbffr