Director of Module Development
Xscape Photonics Inc, Santa Clara, CA, United States
Role Overview
We’re looking for a senior leader to drive Module Development for next-generation ELSFP external laser modules. This person will own the full development of highly integrated modules that bring together PCB electronics, photonics, packaging, and thermal design into a product that can scale in manufacturing.
The role requires leading cross-functional engineering teams to deliver high-performance, low-noise, and thermally stable laser modules from early concept through volume production, while also shaping the architecture and development path for future generations.
Key Responsibilities Module Architecture & Development Own end-to-end module development, including: PCB design for laser drivers, TEC control, and monitoring circuits Optical subassemblies and laser integration Mechanical packaging and thermal design Define overall module architecture and make design trade-offs across performance, cost, power, and manufacturability Drive tight optical, electrical, and thermal co-design within ELSFP constraints Engineering Leadership Build and lead a multidisciplinary module development team across: PCB / electronics Mechanical / thermal engineering Test and validation Set technical direction, lead design reviews, and maintain a high bar for execution Establish strong practices for design, integration, debug, and validation Execution & Delivery Drive development from prototype through qualification (EVT/DVT/PVT) and production ramp Partner closely with TPM and operations to deliver on schedule Own key module metrics including noise, stability, yield, reliability, and cost PCB & Electronics Oversee development of low-noise, high-performance PCBs that are critical to laser stability Ensure strong power integrity, signal integrity, and EMI performance Guide integration of: Laser drivers TEC controllers and thermal feedback loops Photodiode sensing and control systems Manufacturing & Supply Chain Define module assembly flow, test strategy, and calibration processes Work closely with CMs, ODMs, and suppliers on: PCB fabrication and assembly Laser and optical component sourcing Module packaging and alignment Drive DFM/DFT, yield improvement, and cost reduction Reliability & Quality Ensure compliance with reliability and qualification requirements Lead failure analysis and root-cause resolution across module and PCB-related issues Required Qualifications BS or MS in Electrical Engineering, Photonics, Physics, or a related field 12–15+ years of experience in optical modules or other complex hardware systems 5+ years of leadership experience in module, subsystem, or product development Strong technical depth in: PCB design, including mixed-signal, low-noise, PI/SI considerations Module and system integration Proven track record of bringing hardware products into volume production Preferred Qualifications Experience with ELSFP, QSFP-DD, CFP2, or similar optical modules Background in tunable or coherent laser systems Familiarity with: TEC-based thermal control Optical packaging and alignment Stabilization control loops and supporting firmware Experience working in startup or fast-scaling environments
Key Responsibilities Module Architecture & Development Own end-to-end module development, including: PCB design for laser drivers, TEC control, and monitoring circuits Optical subassemblies and laser integration Mechanical packaging and thermal design Define overall module architecture and make design trade-offs across performance, cost, power, and manufacturability Drive tight optical, electrical, and thermal co-design within ELSFP constraints Engineering Leadership Build and lead a multidisciplinary module development team across: PCB / electronics Mechanical / thermal engineering Test and validation Set technical direction, lead design reviews, and maintain a high bar for execution Establish strong practices for design, integration, debug, and validation Execution & Delivery Drive development from prototype through qualification (EVT/DVT/PVT) and production ramp Partner closely with TPM and operations to deliver on schedule Own key module metrics including noise, stability, yield, reliability, and cost PCB & Electronics Oversee development of low-noise, high-performance PCBs that are critical to laser stability Ensure strong power integrity, signal integrity, and EMI performance Guide integration of: Laser drivers TEC controllers and thermal feedback loops Photodiode sensing and control systems Manufacturing & Supply Chain Define module assembly flow, test strategy, and calibration processes Work closely with CMs, ODMs, and suppliers on: PCB fabrication and assembly Laser and optical component sourcing Module packaging and alignment Drive DFM/DFT, yield improvement, and cost reduction Reliability & Quality Ensure compliance with reliability and qualification requirements Lead failure analysis and root-cause resolution across module and PCB-related issues Required Qualifications BS or MS in Electrical Engineering, Photonics, Physics, or a related field 12–15+ years of experience in optical modules or other complex hardware systems 5+ years of leadership experience in module, subsystem, or product development Strong technical depth in: PCB design, including mixed-signal, low-noise, PI/SI considerations Module and system integration Proven track record of bringing hardware products into volume production Preferred Qualifications Experience with ELSFP, QSFP-DD, CFP2, or similar optical modules Background in tunable or coherent laser systems Familiarity with: TEC-based thermal control Optical packaging and alignment Stabilization control loops and supporting firmware Experience working in startup or fast-scaling environments