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Intel Corporation

Senior Thermal Architect: GPU/AI Packaging

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading technology company based in Phoenix, Arizona, is seeking a Senior Packaging Thermal Architect to lead the thermal design and strategy for advanced GPU and data center products. This critical role requires expertise in thermal architecture and a minimum of 10 years in thermal design of semiconductor products. The ideal candidate will also have proficiency in thermal simulation tools and experience with high-performance computing. Competitive compensation package with excellent benefits is provided. #J-18808-Ljbffr