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Intel Corporation

Senior Thermal Architect: GPU/AI Packaging

Intel Corporation, Phoenix, Arizona, United States, 85003

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A leading technology company in Phoenix is seeking a Senior Packaging Thermal Architect to lead thermal design for next-generation GPU and AI products. This critical role focuses on defining thermal strategies and delivering advanced packaging solutions while ensuring compliance with performance standards. Candidates should have an MS or PhD in Mechanical Engineering and extensive experience in thermal design and architecture. This position offers a competitive salary range and demands onsite presence. #J-18808-Ljbffr