Senior Thermal Architect: GPU/AI Packaging

A leading semiconductor company in Phoenix is seeking a Senior Packaging Thermal Architect to lead thermal design and strategy for next-generation GPU and data center products. This role emphasizes innovative thermal architecture and collaboration with cross-functional teams. The ideal candidate will have over 10 years of experience in thermal design and advanced packaging technologies, with proficiency in thermal simulation tools. Competitive salary and benefits are offered. #J-18808-Ljbffr