A semiconductor company is seeking a Director, Chiplets and FCBGA for its Tempe, AZ office. In this role, you will manage the development of advanced chiplet-based IC packages, coordinate with R&D teams, and interface with Tier 1 customers. Ideal candidates will have over 10 years of experience in semiconductor package development and a strong understanding of IC package design and materials. This position offers a hybrid work schedule, with some travel required.
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